Aluminum PCB Structure

Aluminum PCBs feature excellent electrical performance, thermal dissipation capability, electromagnetic shielding, high dielectric strength and bending resistance, widely applied in numerous industries like high power LED lighting, power, television backlight source, automotives, computers, air-conditioner variable-frequency module, aerospace electronics, telecommunications, medical care, audio etc.

1. Copper Foil Layer

Aluminum CCL features the same copper foil layer with ordinary CCLs and large current carrying capacity is required by circuit layer, which is why relatively thick copper circuit is selected with thickness from 1oz to 10oz. The back side of copper foil has to go through oxidation treatment in a chemical way while the surface side should go through zincing and brass plating in order to improve peel-off strength.

2. Dielectric Layer

Dielectric layer is composed by a layer of thermally conductive dielectric material with low thermal resistance whose thickness is from 50μm to 200μm, which is the core technology of aluminum CCL. It performs excellently in anti-thermal aging and can withstand mechanical and thermal stress.

3. Aluminum Base Layer

Aluminum base layer is actually aluminum substrate material that is the supporting component of aluminum base layer. It is required to be highly thermal conductive and suitable for ordinary mechanical manufacturing such as drilling, punching and cutting.

4. Aluminum Base Membrane

Aluminum base membrane plays a role in protecting aluminum surface from scraping and agent etching. Membrane can be classified into ordinary (lower than 120°C) and anti high temperature (250°C). The latter type meets the requirement of HASL (hot air solder leveling) as surface finish.